IEEE Signal Processing Magazine

Shih-Fu Chang, Editor-in-Chief, Columbia University (e-mail)
Li Deng, Area Editor - Feature Articles, Microsoft Research (e-mail)
Adriana Dumitras, Area Editor - Columns and Forums, Apple Inc. (e-mail)
Douglas Williams, Area Editor - Special Issue, Georgia Institute of Technology (e-mail)
Min Wu, Area Editor for e-Newsletter, University of Maryland, College Park(e-mail)

Editorial Board

Alex Acero, Microsoft Research
John G. Apostolopoulos, Hewlett-Packard Laboratories
Philip A. Chou, Microsoft Research
Ingemar Cox, University College London
Sadaoki Furui, Tokyo Institute of Technology, Japan
Yingbo Hua, UC Riverside
Alex Gershman, Darmstadt University of Technology, Germany
Bede Liu, Princeton University
B.S. Manjunath, UC Santa-Barbara
Nasir Memon, Polytechnic University
Alex Kot Nanyang, Technological University, Singapore
Antonio Ortega, University of Southern California
Thrasos Pappas, Northwestern University
Soo-Chang Pei, National Taiwan University
Michael Picheny, IBM TJ Watson Research Center
Vincent Poor, Princeton University
Jose C. Principe, University of Florida
Majid Rabbani, Eastman Kodak Company
Todd Reed, University of Hawaii at Manoa
Phillip A. Regalia, Catholic University of America
Hideaki Sakai, Kyoto University, Japan
Dan Scholfeld, University of Illinois at Chicago
Peter Stoica, Uppsala University, Sweden
Lee Swindlehurst, Brigham Young University
Murat Tekalp, Koc University, Turkey
Ahmed Tewfik, University of Minnesota
Isabel Trancoso, Instituto Superior Técnico, Lisbon, Portugal
Jennifer Trelewicz, IBM Almaden Research Center
Rabab Ward, University of British Columbia
Xiaodong Wang, Columbia University

Associate Editors for Columns and Forums

Ghassan AlRegib, Georgia Institute of Technology, News: In the Spotlight (e-mail)
Greg Slabaugh, Siemens Corporate Research, Applications: DSP Applications (e-mail)
Shrikanth Narayanan, University Southern California, New DSP topics: Exploratory DSP (e-mail)
Stephen T.C. Wong, Harvard University, New DSP topics: Life Sciences (e-mail)
Aleksandra Mojsilovic, IBM T.J. Watson Research Center, DSP Advice: Lecture Notes (e-mail)
Dan Ellis, Columbia University, DSP Advice: Lecture Notes (e-mail)
Rick Lyons, Besser Associates, DSP Advice: DSP Tips & Tricks (e-mail)
C. Britton Rorabaugh, DRS C3 Systems Co., DSP Advice: DSP Tips & Tricks (e-mail)
Adriana Dumitras, Apple Inc., Perspectives: DSP History  (e-mail)
George S. Moschytz, Bar-Ilan University, Perspectives: DSP History (e-mail)
Hari Sundaram, Arizona State University, Education: DSP Education (e-mail)
Berna Erol, Ricoh California Research Center, Resources: Reader's Choice (e-mail)
Fernando Pereira, Instituto Superior Tecnico, Portugal, Resources: Standards in a Nutshell (e-mail)
Alen Docef, Virginia Commonwealth University, Resources: Best of the Web (e-mail)
Wade Trappe, Rutgers University, Resources: Book Review (e-mail)
Konstantinos Konstantinides, Hewlett-Packard, Resources: New Products (e-mail)
Anthony Vetro, Mitsubishi Electric Research Labs, Forums: DSP Forum (e-mail)

Associate Editors for e-Newsletter

Nitin Chandrachoodan, India Institute of Technologies, India, Digital Production (e-mail)
Huaiyu Dai, North Carolina State University, Conference and Publication News (e-mail)
Alessandro Piva, University of Florence, Italy, Local Chapters and Ph.D. Theses (e-mail)
Mihaela van der Schaar, University of California, Los Angeles, Technical Committees, Industry Consortiums and Standards (e-mail)